Tech showcase: Infrastructure solutions for dynamic AI deployments

Demand for AI-powered applications are rising at an unprecedented rate, driving a necessary review as to how we approach data center design, configuration, and management. This scenario requires a full-circle approach to infrastructure deployment – power, cooling, monitoring, and even maintenance services all considered in one package. Join Vertiv experts as they walk through innovative critical IT solutions tailored for the efficient deployment of dynamic AI applications. This tech showcase will help you:

• Understand the necessary infrastructure imperatives that should be considered in the advent of AI applications
• Learn about the cutting-edge, high-density solutions developed closely with leading chipmaker Nvidia to allow for scalability and flexibility
• Discover Vertiv's comprehensive solution portfolio for AI deployments across various scenarios - hyperscalers, enterprises, and on-prem

Speaker:

Chin Tuck Chien

HPC AI Business Solution Manager, Asia, Vertiv

Chin Tuck Chien is the HPC/AI Business Solution Manager for Vertiv in the Asia region. He drives the growth of Vertiv’s HPC/AI business, working across verticals such as channel partners, colocation providers, and edge applications to deliver tailored solutions for complex requirements. Tuck also leads enablement efforts, including partner certification programs and internal training, while working closely with sales, engineering, and marketing teams to align solutions with customer needs and market trends.

Prior to this role, Tuck was a Senior Product Specialist for High Density and Rack Thermal at Vertiv in Southeast Asia. He provided his product and technical expertise on Vertiv’s portfolio of high density and rack thermal solutions, with a strong focus on high-performance computing and artificial intelligence. He first joined Vertiv in 2019 as a Graduate Engineer, before assuming various technical roles including Application Engineer and Product Engineer for Edge Thermal solutions. He holds a bachelor’s degree in mechanical engineering (Honors) from Monash University in Malaysia.